Capabilities

Design & Simulation (Sentaurus, K-layout, etc)

Layout by Cadence

Device/IC Fabrication: HMNTL Nanofab User Facility

Device/IC Characterization

Probe Station & Power Device Analyzer up to 3kV

10kV PCB Test Bench

Cryogenic 10kV Vacuum Probe Station

Nextron High Temperature Micro Probe System up to 1000K

RF/Mixed-Signal Measurement

Wire Bonder

Material Characterization: UIUC Material Research Laboratory

Device Irradiation (Collaborate with BNL, GSI, etc)

Right: Device Transfer Characteristics Pre-radiation vs. Post-radiation

Chu Group

2262, Holonyak Micro & Nanotechnology Laboratory

208 N. Wright Street

Urbana, IL 61801

Email: rchu@illinois.edu