Integrated VCSEL Device Drawing

The material used to fabricate electronic devices and the materials used to fabricate photonic, light–based, devices are typically different materials. Bonding together these materials allows for both electronic and photonic performance on the same chip. Small lasers (VCSELs) are then fabricated into this integrated material to prove the efficacy of this bonding process and to show potential improvements from using integrated material.

Epitaxial Tranfer Integration Process

Related News + Publications

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  Robert, Kevin, and Leah Present at the Engineering Research Fair
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  Laser Islands: Illinois Researcher Leah Espenhahn Shows How to Fully Integrate VCSELs on Silicon
  Leah Espenhahn, Kevin Pikul, and Prof. Dallesasse are interviewed about their article published in Compound Semiconductor. They explore the topics of VCSELs and III-V/Si integration via epitaxial transfer. HMNTL Article Compound Semiconductor Article
• Heterogeneously integrated VCSELs on silicon
  A wafer-scale CMOS-compatible process for heterogeneous integration of III-V epitaxial material onto silicon for photonic device fabrication is presented. Transfer of AlGaAs-GaAs Vertical-Cavity Surface-Emitting Laser (VCSEL) epitaxial material onto silicon using a carrier wafer process and metallic bonding is used to form III-V islands which are subsequently processed into VCSELs. The transfer process begins with… Read more: Heterogeneously integrated VCSELs on silicon
• Heterogeneous Integration for Silicon Photonic Systems: Challenges and Approaches
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  John Carlson wins Best Poster Award at CS MANTECH 2018
  At the International Compound Semiconductor Manufacturing Technology (CS MANTECH) 2018, John Carlson and Patrick Su were honored with the Best Poster Award on a method of integrating III-V semiconductor material suitable for lasers onto silicon which is used for CMOS electronics. John has demonstrated a novel demonstration of epitaxial bonding and transfer for heterogeneous integration… Read more: John Carlson wins Best Poster Award at CS MANTECH 2018