B. Li and PD Franzon, “Machine learning in physical design”, IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2016, pp. 147-150.

S.J. Park, B. Bae, J. Kim & M. Swaminathan, “Application of Machine learning for Optimization of 3-D Integrated Circuits and Systems,” IEEE Transactions on Very Large (VLSI) Systems, 2017, Vol 25, Issue 6, pp. 1856 – 1865.

H.M. Torun, M, Swaminathan, “Black-box optimization of 3D integrated systems using machine learning”, IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2017.

Yu, M. Swaminathan, C. Ji and D. White, “A method for creating behavioral models of oscillators using augmented neural networks”, IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2017.

Z. Chen, M. Raginsky and E. Rosenbaum, “Verilog-A compatible recurrent neural network model for transient circuit simulation,” 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2017, pp. 1-3.

T. Nguyen, J.E. Schutt-Aine, Y. Chen, “Volterra kernels extraction from frequency-domain data for weakly non-linear circuit time-domain simulation”, 2017 IEEE Radio and Antenna Days of the Indian Ocean (RADIO), 2017, pp. 1-2.

E. J. Wyers, W. Qi and P. D. Franzon, “A robust calibration and supervised machine learning reliability framework for digitally-assisted self-healing RFICs,” 2017 IEEE 60th International Midwest Symposium on Circuits and Systems (MWSCAS), Boston, MA, 2017, pp. 1138-1141.

H. Yu, C. Ji, M Swaminathan and D. White, “A non-linear behavioral modeling approach for voltage-controlled oscillators using augmented neural networks”, IEEE/MTT-S International Microwave Symposium (IMS), June, 2018.

Y. Xiu, S. Sagan, A. Battini, X. Ma, M. Raginsky and E. Rosenbaum,” “Stochastic modeling of air electrostatic discharge parameters,” IEEE Int. Reliability Physics Symposium, 2018, pp 2C.2-1-2C.2-10.

J. Xiong, Z. Chen, et al., “Enhanced IC modeling methodology for system-level ESD simulation,” 40th EOS/ESD Symposium Proceedings, 2018.

X. Ma, M. Raginsky and A. C. Cangellaris, “A machine learning methodology for inferring network S-parameters in the presence of variability,” 2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI), Brest, 2018, pp. 1-4.

Y. Wang and P.D. Franzon “RFIC IP Redesign and Reuse through Surrogate Based Machine Learning Method” IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), 2018.

H. M. Torun, M. Swaminathan, A. Kavungal Davis and M. L. F. Bellaredj, “A Global Bayesian Optimization Algorithm and Its Application to Integrated System Design,” IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 26, no. 4, April 2018, pp. 792-802.

H. Torun & M. Swaminathan. Artificial Intelligence and Its Impact on System Design, ECTC, San Diego, CA, May 29 – June 1, 2018.

T. Nguyen, J.E. Schutt-Aine, “A Pseudo-supervised Machine Learning Approach to Broadband LTI Macro-modeling” International Microwave Symposium (IMS), Philadelphia, Pennsylvania, June 10-15, 2018.

J. Xiong, Z. Chen, Y. Xiu, Z. Mu, M. Raginsky, E. Rosenbaum, “Enhanced IC Modeling Methodology for System-level ESD Simulation”, 2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), Reno, NV, USA, September 23-28, 2018, pp.1-10.

Y. Wang, P.D. Franzon, “RFIC IP Redesign and Reuse Through Surrogate Based Machine Learning Method”, 2018 IEEE International Conference on Numerical Electromagnet and Multiphysics Modeling and Optimization, Reykjavik, Iceland, August 8-10, 2018, pp. 1-4.

H. M. Torun, J.A. Hejase, J. Tang, W. D. Becker, M. Swaminathan, “Bayesian Active Learning for Uncertainty Quantification of High Speed Channel Signaling”, 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, USA October 14-17, 2018, pp. 311-313.

H. Yu, M. Swaminathan & H. Chalmalasetty, “Behavioral Modeling of Steady-State Oscillators with Buffers Using Neural Networks”, 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, USA, October 14-17,2018, pp. 307-309.

M. A. Ahadi, H. Yu, J. A. Hejase, W. D. Becker, M. Swaminathan, “Polynomial Chaos modeling for jitter estimation in high-speed links”, 2018 IEEE International Text Conference (ITC), Phoenix, AZ, USA, October 29 – November 1, 2018 , pp. 1-10.

B. Li, P. Franzon, Y. Choi, C. Cheng, “Receiver Behavior Modeling Based on System Identification”, 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, USA, October 14-17,2018, pp. 299-301.

H. M. Torun and M. Swaminathan, “A New Machine Learning Approach for Optimization and Tuning of Integrated Systems”, DesignCon, Santa Clara, CA, 2018.

H. M. Torun, M. Swaminathan, “Bayesian Framework for Optimization of Electromagnetics Problems”, International Workshop on Computing, Electromagnetics, and Machine Intelligence (CEMi), Stellenbosch, South Afrıca, Nov 21, 2018 – Nov 24, 2018.

D. Das, S. Maity, S. B. Nasir, S. Ghosh, A. Raychowdhury and S. Sen, “ASNI: Attenuated Signature Noise Injection for Low-Overhead Power Side-Channel Attack Immunity,” in IEEE Transactions on Circuits and S Systems I: Regular Papers, vol. 65, no. 10, Oct. 2018, pp. 3300-3311

K. Roy, H. T. Mert and M. Swaminathan, “Preliminary Application of Deep Learning to Design Space Exploration,” 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), Chandigarh, India, 2018, pp. 1-3.

E. Rosenbaum, Z. Chen, J. Xiong, “Component Modeling for System-level ESD Simulation,” InCompliance, vol. 11, no. 4, April 2019, pp. 16-19

A. Yang, A. Ghassami, E. Rosenbaum, and N. Kiyavash, “Data-Driven Reliability for Datacenter Hard Disk Drives,” Electronic Device Failure Analysis Magazine, vol. 21, no. 2, May 2019, pp. 16-21.

B. Tzen and M.Raginsky, “Theoretical Guarantees for Sampling and Inference in Generative Models with Latent Diffusions”, Mar. 2019.

M. A. Ahadi, J. A. Hejase, W. D. Becker, M Swaminathan, “A Hybrid Methodology for Jitter and Eye Estimation in High-Speed Serial Channels Using Polynomial Chaos Surrogate Models” IEEE Access, vol. 7, 2019, pp. 53629–40.

B. Huggins, et al. “Estimating Pareto Optimum Fronts to Determine Knob Settings in Electronic Design Automation Tools.” 20th International Symposium on Quality Electronic Design (ISQED), 2019, pp. 304–310.

M. Ahadi, A. Varma, K. Keshavan, M. Swaminathan “Design Space Exploration with Polynomial Chaos Surrogate Models for Analyzing Large System Designs,” DesignCon, Jan. 2019.

M. Ahadi, J. Hejase, W. Becker, M. Swaminathan “Eye Diagram and Jitter Estimation in SerDes Designs using Surrogate Models Generated with Polynomial Chaos Theory,” DesignCon, Jan. 2019.

H. Yu, Jaemin Shin, Tim Michalka, Mourad Larbi, M. Swaminathan “Behavioral Modeling of Tunable I/O Drivers with Pre-emphasis Using Neural Networks”, 20th International Symposium on Quality Electronic Design (ISQED), 2019.

M. Ahadi Dolatsara, A. Varma, K. Keshavan, and M. Swaminathan, “A Modified Polynomial Chaos Modeling Approach for Uncertainty Quantification”, 2019 IEEE International Applied Computational Electromagnetics Society Symposium (ACES), Apr. 14-19, 2019.

M. Larbi , H. M. Torun, and M. Swaminathan, “Estimation of Parameter Variability for High Dimensional Microwave Problems via Partial Least Squares”, IEEE MTT-S International Microwave Symposium (IMS), Boston, Massachusetts, USA, June 2-7, 2019.

D. Das, A. Golder, S. Ghosh, A. Raychowdhury and S. Sen, “X-DeepSCA: Cross-Device Deep Learning Side Channel Attack,” 56th ACM/IEEE Design Automation Conference (DAC), Aug. 2019.

J. Hanson and M. Raginsky, “Universal approximation of input-output maps by temporal convolutional nets”, Neural Information Processing Systems (NeurIPS), Vancouver, Canada, December 8-14, 2019.

A. Golder, D. Das, J. Danial, S. Ghosh, S. Sen and A. Raychowdhury, “Practical Approaches Toward Deep-Learning-Based Cross-Device Power Side-Channel Attack,” in IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Early Access, July 2019.

A. Agnesina, E. Lepercq, J. Escobedo and S. K. Lim, “Reducing Compilation Effort in Commercial FPGA Emulation Systems Using Machine Learning,” 2019 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Westminster, CO, USA, 2019, pp. 1-8.

H. Liu, Y. Zhou, A. Beirami, and D. Baron, “Nonlinear function estimation with empirical Bayes and approximate message passing,” Allerton Conf. Communication, Control, & Computing, Sep. 2019.

Y. Lu, J. Lee, A. Agnesina, K. Samadi and S. K. Lim, “GAN-CTS: A Generative Adversarial Framework for Clock Tree Prediction and Optimization,” 2019 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Westminster, CO, November 4-7, 2019.

H. M. Torun, A. C. Durgun, K. Aygün and M. Swaminathan, “Enforcing Causality and Passivity of Neural Network Models of Broadband S-Parameters,” 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Montreal, QC, Canada, 2019, pp. 1-3.

H. Ma, E-P. Li, A. C. Cangellaris, X. Chen, “Comparison of Machine Learning Techniques for Predictive Modeling of High-Speed Links,” in Proc. 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Montreal, Canada, October 2019.

H. Ma, E. Li, A. C. Cangellaris and X. Chen, “Support Vector Regression-Based Active Subspace (SVR-AS) Modeling of High-Speed Links for Fast and Accurate Sensitivity Analysis,” in IEEE Access, vol. 8, 2020, , pp. 74339-74348,

H. M. Torun et al., “A Spectral Convolutional Net for Co-Optimization of Integrated Voltage Regulators and Embedded Inductors,” 2019 IEEE/ACM Conference on Computer-Aided Design (ICCAD), Westminster, CO, USA, 2019, pp. 1-8.

O. W. Bhatti and M. Swaminathan, “Impedance Response Extrapolation of Power Delivery Networks using Recurrent Neural Networks,” 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Montreal, QC, Canada, 2019, pp. 1-3.

A. Balakir, A. Yang and E. Rosenbaum, “An Interpretable Predictive Model for Early Detection of Hardware Failure”, 2020 IEEE International Reliability Physics Symposium (IRPS), Dallas, Texas, USA April 28 – May 30, 2020.

J. Hanson and M. Raginsky, “Universal simulation of stable dynamical systems by recurrent neural nets”, Proceedings of the 2nd Conference on Learning for Dynamics and Control (L4DC), June, 2020.

F. Aydin, P. Kashyap, S Potluri, P. Franzon, A. Aysu, “DeePar-SCA: Breaking Parallel Architectures of Lattice Cryptography via Learning Based Side-Channel Attacks”, International Conference on Embedded Computer Systems: Architectures, Modeling and Simulation (SAMOS), October 7, 2020.

Y-C. Lu, S. S. Kiran Pentapati, L. Zhu, K. Samadi and S. K. Lim, “TP-GNN: A Graph Neural Network Framework for Tier Partitioning in Monolithic 3D ICs,” 2020 57th ACM/IEEE Design Automation Conference (DAC), San Francisco, CA, USA, 2020, pp. 1-6

H. Ma, E-P. Li, A.C. Cangellaris, X. Chen, “Expedient Prediction of Eye Opening of High-Speed Links with Input Design Space Dimensionality Reduction,” in Proc 2020 IEEE International Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, Reno, NV, July 2020.

A. Yang, A-E.Ghassami, M. Raginsky, N. Kiyavash, and E. Rosenbaum, “Model-Augmented Conditional Mutual Information Estimation for Feature Selection”, Uncertainty in Artificial Intelligence, August 3-6, 2020.

H. M. Torun, A. C. Durgun, K. Aygün and M. Swaminathan, “Causal and Passive Parameterization of S-Parameters Using Neural Networks,” in IEEE Transactions on Microwave Theory and Techniques, vol. 68, no. 10, Oct. 2020, pp. 4290-4304.

M. Swaminathan, H. M. Torun, H. Yu, J. A. Hejase and W. D. Becker, “Demystifying Machine Learning for Signal and Power Integrity Problems in Packaging,” in IEEE Transactions on Components, Packaging and Manufacturing Technology*,* vol. 10, no. 8, Aug. 2020, pp. 1276-1295.

Regazzoni et al., “Machine Learning and Hardware security: Challenges and Opportunities -Invited Talk-,” 2020 IEEE/ACM International Conference On Computer Aided Design (ICCAD), San Diego, CA, USA, 2020, pp. 1-6.

P. Kashyap, F. Aydin, S. Potluri, P. Franzon and A. Aysu, “2Deep: Enhancing Side-Channel Attacks on Lattice-Based Key-Exchange via 2D Deep Learning,” in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, November 17, 2020.

L. Francisco, et al., “Design Rule Checking with a CNN Based Feature Extractor”, in MLCAD ’20: Proceedings of the 2020 ACM/IEEE Workshop on Machine Learning for CAD, Virtual Event Iceland, November 2020, pp 9-14.

I. Turtletaub, M. Ibrahim, G. Li, and P. Franzon, “ Application of Quantum Machine Learning to VLSI Placement,” MLCAD ’20: Proceedings of the 2020 ACM/IEEE Workshop on Machine Learning for CAD, Virtual Event Iceland, November 2020, pp, 61-66.

Rosenbaum, J. Xiong, A. Yang, Z. Chen and M. Raginsky, “Machine Learning for Circuit Aging Simulation,” 2020 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, 2020, pp. 39.1.1-39.1.4, doi: 10.1109/IEDM13553.2020.9371931.

Y-C Lu, S. Nath, S. S. Kiran Pentapati and S. K. Lim, “A Fast Learning-Driven Signoff Power Optimization Framework,” 2020 IEEE/ACM International Conference On Computer Aided Design (ICCAD), San Diego, CA, USA, 2020, pp. 1-9.

H. Huang, A. C. Cangellaris and X. Chen, “Stochastic-Galerkin Finite-Difference Time-Domain for Waves in Random Layered Media,” 2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), Hangzhou, China, 2020, pp. 1-4, doi: 10.1109/NEMO49486.2020.9343635.

Y-C Lu, S. Pentapati, and S. K. Lim. 2021, “The Law of Attraction: Affinity-Aware Placement Optimization using Graph Neural Networks”, Proceedings of the 2021 International Symposium on Physical Design (ISPD ‘21), Association for Computing Machinery, New York, NY, USA, 7–14. DOI:https://doi.org/10.1145/3439706.3447045

Y-C Lu, S Pentapati, and S.K Lim. The Law of Attraction: Affinity-Aware Placement Optimization using Graph Neural Networks. In Proceedings of the 2021 International Symposium on Physical Design (ISPD ’21). Association for Computing Machinery, New York, NY, USA, March 22-24, 2021. pp7–14. DOI:https://doi.org/10.1145/3439706.3447045

E. Rosenbaum, J. Xiong, A. Yang and M. Raginsky, “Neural networks for transient modeling of circuits,” ACM/IEEE 3rd Workshop on Machine Learning for CAD (MLCAD), Aug 30 – Sept 3, 2021, doi: 10.1109/MLCAD52597.2021.9531153

L. Francisco, P. Franzon and W. R. Davis, “Fast and Accurate PPA Modeling with Transfer Learning,” 2021 ACM/IEEE 3rd Workshop on Machine Learning for CAD (MLCAD), Aug 30 – Sept 3, 2021, pp. 1-6, doi: 10.1109/MLCAD52597.2021.9531109.

J. Xiong, Z. Chen, M. Raginsky and E. Rosenbaum, “Statistical Learning of IC Models for System-Level ESD Simulation,”*IEEE Transactions on Electromagnetic Compatibility,* vol. 63, no. 5, pp. 1302-1311, Oct. 2021, doi: 10.1109/TEMC.2021.3076492.

O.W. Bhatti, H. M. Torun and M. Swaminathan, “HilbertNet: A Probabilistic Machine Learning Framework for Frequency Response Extrapolation of Electromagnetic Structures,” in *IEEE Transactions on Electromagnetic Compatibility*, Nov 24, 2021, p 1-13. doi: 10.1109/TEMC.2021.3119277.

G. Aydin & E. Karabulut, & S. Potluri, & E. Alkim & A. Aysu, “RevEAL: Single-Trace Side-Channel Leakage of the SEAL Homomorphic Encryption Library”, 2022 Design, Automation and Test in Europe (DATE), December 2021.

Y-C. Lu, S. Nath, V. Khandelwal, and S.K. Lim, “RL-Sizer: VLSI Gate Sizing for Timing Optimization using Deep Reinforcement Learning”, 58^{th} ACM/IEEE Design Automation Conference (DAC), Dec 5-9, 2021. 10.1109/DAC18074.2021.9586138 **INDUSTRY CO-AUTHOR**

O.W. Bhatti, N. Ambasana and M. Swaminathan, “Inverse Design of Power Delivery Networks using Invertible Neural Networks,” *2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)**,* 2021, pp. 1-3, doi: 10.1109/EPEPS51341.2021.9609211.

N. Ambasana *et al*., “Invertible Neural Networks for High-Speed Channel Design & Parameter Distribution Estimation,” *2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)**,* 2021, pp. 1-3, doi: 10.1109/EPEPS51341.2021.9609225.

X-J. Shangguan, H. Ma, A. C. Cangellaris and X. Chen, “Effect of Sampling Method on the Regression Accuracy for a High-Speed Link Problem,” 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2021, pp. 1-3, doi: 10.1109/EPEPS51341.2021.9609130.

O. W. Bhatti et al., “Comparison of Invertible Architectures for High Speed Channel Design,” 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2021, pp. 1-3, doi: 10.1109/EDAPS53774.2021.9657014. **BEST STUDENT PAPER AWARD**